The aim of this direction is to investigate the heat dissipation for high-heat-flux electronic devices and thermal control technology for spacecraft. To propose reliable solution with stabilization and high efficiency for various heat dissipation objects. We use numerical simulations to optimize the system structure, and use experiments to improve system performance, in order to develop a high-efficiency heat dissipation device for electronics. Major technologies: (1) Loop heat pipe (LHP); (2) Pump auxiliary capillary phase transformation circuit; (3) Micro channel fluid loop system; (4) Micro channel supercooling nucleate boiling circuits.
